Job Details
We've partnered with an exciting start-up in Austin who are looking for a Director of Engineering.
This is an outstanding chance for a highly imaginative engineer specializing in power semiconductors or solid-state physics to spearhead the design and advancement of cutting-edge power packaging innovations.
You will hold a central position in bringing a novel, energy-efficient, two-way power semiconductor architecture to the market. Leading the way in product design, enhancement, production, testing, reliability, and long-term product strategy, affording the opportunity to showcase your engineering skills as the primary overseer of power modules within the company.
Responsibilities :
- Collaborate with device engineers, process engineers, and product engineers to devise and create power modules that align with electrical, mechanical reliability, and cost criteria.
- Assume leadership of projects from their conceptualization through to production. Conduct thermal, mechanical, thermal-mechanical, and electrical simulations to guarantee that power modules fulfil the prescribed standards.
- Forge close partnerships with manufacturing collaborators to implement the design, enhance the packaging process, validate performance to guarantee resilient and compliant designs, and ensure manufacturability without defects.
- Create all necessary development and verification tests and reliability and quality methodologies to guarantee the attainment of all functional objectives while adhering to industry and customer benchmarks.
- Engage with customers during sampling, evaluation, and failure analysis, and recommend necessary alterations to device, process, and product engineers.
- Take charge, lead, and assume responsibility for module designs.
- Actively partake in shaping both short-term and long-term technology and product roadmaps.
- Specify developmental milestones and prioritize development efforts.
Requirements:
- Possession of a Master's or PhD degree in Electrical Engineering, Mechanical Engineering, or Solid State Physics.
- A minimum of 5 years' expertise in power semiconductor technology and the development of related products.
- Comprehensive understanding of power semiconductor configurations, with a special focus on MOSFETs, IGBTs, and BJTs.
- A degree in Electrical, Computer, Mechanical Engineering, or an equivalent field, coupled with at least 5 years of industry experience.
- Proficiency in CAD software, including SolidWorks, AutoCAD, ProE, Creo Parametric, and Altium.
- Experience in simulation using COMSOL Multiphysics, Ansys, or SolidWorks Simulation.
- Knowledge of power module reliability and various failure modes.
- General familiarity with power devices like IGBTs, BJTs, MOSFETs, and Diodes (both Si and SiC).
- Understanding of industry-standard and cutting-edge assembly packaging processes, including wire bonding, double-sided cooling, die/substrate attachment, vacuum reflow soldering, encapsulation, molding, plating, and more.
- Familiarity or experience with common packaging materials such as solders, ceramics, silicone gel, epoxies, polymers, DBC, etc.
- Proficiency in using electronic packaging test equipment, including C-SAM, x-ray, pull testers, shear testers, etc.
- Knowledge of Design of Experiments, 8D problem-solving methodology, and data analysis techniques.